/

 


For Gold plating and gold electroplating requirements, we have  facilities like both small and large parts in various sized barrels, racks and wiring.

Gold is unique with its yellow color. Also, gold is a precious metal, which means that it will not oxidize in air, so its electrical conductivity stays uniform over long periods of time. It is ideally suited for gold electroplating applications. Gold plating offers good corrosion resistance, good solderability, and when alloyed with cobalt, it has very good wear resistance. Gold is commonly used in electrical switch contacts, connector pins and barrels, and other applications where intermittent electrical contact occurs.

Gold Plating & Gold Electroplating Specification : 

Specification : MIL-G-45204 Gold Plating, Electrodeposited

Type I 99.7 % gold minimum; hardness grade A, B, or C. Gold plating used for general-purpose, high-reliability electrical contacts, solder ability, and wire wrap connections.

Type II 99.0 % gold minimum; hardness grade B, C, or D. A general-purpose, wear- resistant gold. It will not withstand high-temperature applications because the hardening  agents in the gold plating will oxidize.

Type III 99.9 % gold minimum; hardness grade A only. Gold plating for  semiconductor components, nuclear engineering, thermo compression bonding,  and high-temperature application. 

Gold Plating & Gold Electroplating - purity and coating thickness :

Co-deposited impurities can make soldering more difficult, and for this reason high purity gold plating is preferred. Soldering requirements are best achieved when gold electroplating coatings range between 0.00005 and 0.0001 inch (50 and 100 micro inches) thickness.


Specification :

ASTM B 488 Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses
Type-I 99.7% gold minimum; hardness grade A, B, or C *
Type-II 99.0% gold minimum; hardness grade B, C, or D *
Type-III 99.9 % gold minimum; hardness grade A only *

Specification :

AMS 2422 Gold Plating for Electronic and Electrical Applications
An underplate of copper (from a copper cyanide solution) is required unless the base material is copper or a copper alloy containing less that 15% zinc.

Copper Thickness : Not less than 0.0001" A layer of nickel (from a Watt's or chloride solution) is required over the copper underplate or copper base material.
Nickel Thickness : Not less than 0.0001" The gold (from a cyanide solution) is to be deposited directly on the nickel layer.
Gold Thickness : Not less than 0.00005" on all functional surfaces. Gold Purity: Not less than 99.0% pure.
About solderability : MIL-G-45204 extract: Codeposited impurities can make soldering more difficult, and for this reason high purity gold coatings should be used for those applications. Excellent solderability is best achieved when the gold thickness is between 0.00005 and 0.0001 inch.
About Undercoating: MIL-G-45204 extract :
a) Unless otherwise specified, gold over silver underplate combinations should be excluded from electronics hardware (3.4).
b) When gold is applied to a copper rich surface such as brass, bronze, or beryllium copper, an antidiffusion underplate such as nickel should also be applied (3.4).